Thin Film Deposition Systems (Sputtering, ALD, E-beam & Thermal Evaporation)

PVD Systems (Physical Vapor Deposition Systems) Overview

Physical Vapor Deposition (PVD) is a broad term for deposition techniques that utilize the vaporized form of a desired coating material to create a deposited film on a substrate. Techniques include those that facilitate a physical (rather than chemical) vaporization of the base material, such as electron beam evaporation, thermal evaporation, point source evaporation, and magnetron sputtering.

The Kurt J. Lesker Company manufactures a wide array of PVD systems, including the aptly-named PVD Series, the NANO 36™ platform, the LAB 18 platform, the CMS Series, the ICM Hollow Cathode Magnetron Series and the AXXIS platform.

Each of the PVD systems that we manufacture has a bevy of features and options suitable to tailor a platform for your particular application. These options include: load locks; various sputtering and evaporation sources; ion sources; substrate handling options such as heating, cooling, and biasing; and pumping options. Below is an overview of each platform's basic usage and characteristics.

To request a quotation on one of our PVD system platforms please see the questionnaire:

• PVD Systems (Physical Vapor Deposition Systems) Questionnaire

NANO 36™

NANO 36™ – Affordable, Compact Sputtering or Thermal Evaporation Thin Film Deposition System

• KJLC's most affordable deposition system platform, designed specifically with the entry to mid-level user in mind.
• Typically used in the university and government lab R&D environment.
• Thermal evaporation or magnetron sputtering deposition techniques available.
• Up to 2 HV magnetron sputtering sources or up to 3 thermal evaporation sources available.
• Wet or dry rough pumping, diffusion or turbo pump high vacuum pumping options available.
• Standard configurations compatible with up to 8" substrates, up to 350°C heating, cooling, and biasing options available.
• Simple PLC-based touch screen system control.
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PVD System Series – Economical, Modular Design for Multiple Thin Film Deposition Applications

• The PVD series of platforms is the workhorse of our systems fleet, incorporating a modular design that can be configured for a variety of thin film deposition applications.
• Comprised of 5 standard platforms (PVD 75™, PVD 75LL, PVD 225, PVD 250, and PVD 500) with various chamber size, frame, and system options.
• Up to 6 HV magnetron sputtering sources, up to 2 multi-pocket electron beam evaporation sources, up to 6 thermal evaporation sources, or up to 6 organic evaporation sources available (multi-technique options available).
• Wet or dry rough pumping, turbo pump, or cryogenic pump high vacuum pumping options available.
• Standard configurations compatible with up to 11" OD substrates; custom configurations up to 20" OD substrates, up to 1000°C heating, cooling, and biasing options available.
• Single wafer load lock option available on the PVD 75-LL platform.
• Basic computer system control with recipe and data logging options available
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LAB 18

LAB 18 – Modular Thin Film Deposition System for Sputtering, Electron Beam, & Thermal Evaporation Techniques

• The LAB 18 platform is an economical design geared toward R&D applications.
• Up to 5 HV magnetron sputtering sources, multi-pocket electron beam evaporation source, up to 6 thermal evaporation sources (multi-technique options available).
• Wet or dry rough pumping, turbo, magnetically-levitated turbo, or cryogenic pump high vacuum pumping options available.
• Standard configurations compatible with up to 8" OD substrates; custom configurations available, up to 1000°C heating, cooling, and biasing options available.
• Single wafer load lock option available.
• Basic computer system control with recipe and data logging options available.
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CMS (Combinatorial Materials Science) Series – Advanced Research System utilizing Sputtering or Electron Beam Techniques

• The CMS Series are versatile thin film deposition system platforms for advanced materials research and development.
• Comprised of two standard platforms: CMS-18 and CMS-24.
• Up to 4 HV or 5 UHV magnetron sputtering sources and a linear multi-pocket UHV electron beam evaporation source (multi-technique options available).
• Wet or dry rough pumping, cryogenic or magnetically-levitated turbo high vacuum pumping options available.
• Standard configurations compatible with up to 8" OD substrates, custom configurations available, up to 1000°C heating, cooling, and biasing options available.
• Single or multi-wafer load lock option available.
• Basic computer system control with recipe and data logging options available.
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AXXIS

AXXIS – Co-Sputtering, Thermal Evaporation, & Electron Beam Techniques

• The AXXIS platform incorporates radial deposition ports and a right-angled substrate stage to efficiently facilitate multiple deposition techniques and co-deposited films.
• Up to 6 HV magnetron sputtering sources, multi-pocket electron beam evaporation source, up to 3 thermal evaporation sources (multi-technique options available).
• Wet or dry rough pumping, turbo, magnetically-levitated turbo or cryogenic pump high vacuum pumping options available.
• Standard configurations compatible with up to 8" OD substrates; custom configurations available, up to 550°C heating, cooling, and glow discharge options available.
• Single or multi-wafer load lock option available.
• Basic computer system control with recipe and data logging options available.
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ICM Series – Hollow Cathode Magnetron Sputtering Systems for R&D through Production Applications

• KJLC's newest array of deposition system platforms, designed specifically for use with Isoflux hollow cathode magnetron sputtering sources.
• Typically used in both R&D and production applications.
• Magnetron sputtering deposition techniques.
• Purpose-built for hollow cathode sputtering sources, yet based on existing, proven KJLC system platforms.
• Wet or dry rough pumping, diffusion or turbo pump high vacuum pumping options available.
• Simple PLC-based touch screen system control and full computer controlled automation available.
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ALD Systems (Atomic Layer Deposition Systems) Overview

Atomic Layer Deposition (ALD) is a Chemical Vapor Deposition (CVD) technique that enables surface-controlled film growth on the atomic scale with excellent uniformity. Surface-controlled film growth is a unique feature of ALD that is based on sequential, self-limiting chemical reactions between gas-phase precursor molecules and active surface species. During a typical ALD process, at least two gas-phase precursors are pulsed sequentially into a reaction space where a substrate is located. A complete sequence (or cycle) is made up of a series of pulse and purge steps. Pulse steps are separated by purge steps to remove any remaining precursor and/or volatile reaction by-products from the reaction space between pulses. Thus, a complete cycle requires a minimum of four steps.

The Kurt J. Lesker Company manufactures two ALD systems: the ALD150LE and the ALD150LX.

Each of the ALD systems that we manufacture has a variety of features and options suitable to tailor a platform for your particular process needs. These options include glove boxes, various reactant delivery options, plasma source, and pumping options. Below is an overview of each platform's basic usage and characteristics.

For more information about the capabilities and features of our ALD platforms or to request a quotation please see the links below:

• Atomic Layer Deposition (ALD) – General, Technical, & Process Information
• Atomic Layer Deposition (ALD) Reactant Chamber Design
• ALD Reactant Delivery System (RDS) Designs
• KJLC Process Control Software for ALD Systems
• Atomic Layer Deposition (ALD) System Questionnaire

ALD150LE

ALD150LE – Thermal Atomic Layer Deposition System, Up to 6" Substrates

• KJLC's most affordable atomic layer deposition system platform, designed specifically with the entry to mid-level user in mind.
• Typically used in the university and government lab R&D environment.
• Purely thermal atomic layer deposition technique.
• Up to 8 HVP reactant inputs, or up to 6 HVP with 1 LVP reactant inputs; up to 4 pulsed gas inputs.
• Hydrocarbon or Fomblin^®-prepped wet rough pumping, oil filtration and condensate trap options available.
• Standard configuration compatible with up to 6" OD substrates, up to 500°C heating, glove box option available.
• Notebook PC computer system software with recipe control.
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ALD150LX

ALD150LX – Plasma Enhanced Atomic Layer Deposition System, Up to 6" Substrates

• KJLC's most capable atomic layer deposition system platform, designed specifically with the mid to high-level user in mind.
• Typically used in the university and government lab R&D environment.
• Facilitates thermal and plasma enhanced atomic layer deposition techniques.
• Up to 12 HVP reactant inputs, or up to 2 HVP with 2 LVP reactant inputs, up to 4 pulsed gas inputs.
• Remote plasma source option with up to 3 reactant gas inputs.
• Hydrocarbon, Fomblin-prepped, or dry rough pumping; oil filtration and condensate trap options available.
• RGA package, in-situ ellipsometer, and single or multi-wafer load lock options available.
• Standard configuration compatible with up to 6" substrates, up to 500°C heating.
• Integrated PC computer system control software with recipe control.
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Organic Material Deposition Systems Overview

Organic material deposition is a specific subset of the thermal deposition technique. Due to the volatility of most organic compounds they must be handled differently than stable materials. Highly controllable and precise source temperatures must be used to facilitate evaporation of organic materials, and when loading/unloading sources it is usually desirable to control the surrounding environment through a glove box.

The Kurt J. Lesker Company manufactures three standard system platforms for organic material deposition, Mini-SPECTROS, SPECTROS 100 & 150, and Super-SPECTROS 200.

Each of the SPECTROS^® systems that we manufacture has a variety of features and options suitable to tailor a platform for your particular process needs. These options include: glove boxes; various sputtering and evaporation sources; mask transfer and storage; wedge tool; pellet feeder; substrate handling options such as heating and cooling; and pumping options. Below is an overview of each platform's basic usage and characteristics.

For more information about the capabilities and features of our SPECTROS^® platforms or to request a quotation please see the links below:

• SPECTROS^® Organic Materials Thin Film Deposition Systems Overview
• PVD Systems (Physical Vapor Deposition Systems) Questionnaire

Mini-SPECTROS

Mini-SPECTROS – Organic Thin Film Deposition & Metallization System up to 100mm x 100mm Substrate

• KJLC's most affordable organic material deposition system platform, designed specifically with the entry to mid-level user in mind.
• Typically used in the university and government lab R&D environment.
• Incorporates a sliding front door and hinged rear door for unobstructed chamber access.
• Up to four 1cc or 10cc plug-in low-temperature organic sources; up to four thermal evaporation sources; and up to two magnetron sputtering sources (multi-technique options available).
• Scroll type rough pumping and turbo pump high vacuum pumping options available.
• Standard configurations compatible with up to 4" x 4" square or 6" diameter substrates, up to 350°C heating and cooling, glove box option available.
• Recipe driven computer system control with data logging option available.
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SPECTROS 100 & 150

SPECTROS 100 & 150 – Organic Thin Film Deposition & Metallization System up to 150mm x 150mm Substrate

• KJLC's mid-range organic material deposition system platform, designed for larger substrates with the mid to high-level user in mind.
• Typically used in the university and government lab R&D environment.
• Incorporates a sliding front door with glove box interface flange and hinged rear door for unobstructed chamber access.
• Up to ten 1cc, 10cc, or 35cc plug-in low-temperature organic sources; up to three thermal evaporation sources and pellet feeder option; twelve thermal source array; multi-pocket electron-beam evaporation source (multi-technique options available).
• Scroll type rough pumping; cryogenic high vacuum pumping.
• Standard configurations compatible with 4" x 4" (100mm x 100mm) or 6" x 6" (150mm x150mm) square substrates, up to 350°C heating, glove box, up to 5 mask storage shelves with motorized transfer, and wedge tool options.
• Recipe driven computer system control with data logging option available.
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Super-SPECTROS 200

Super-SPECTROS 200 – Organic Thin Film Deposition & Metallization System up to 200mm x 200mm Substrate

• KJLC's largest organic material deposition system platform, designed with the mid to high-level user in mind.
• Typically used in the university and government lab R&D environment.
• Incorporates a sliding front door with glove box interface flange and sliding rear door for unobstructed chamber access.
• Up to twelve 1cc, 10cc, or 35cc plug-in low-temperature organic sources; up to four thermal evaporation sources and pellet feeder option (multi-technique options available).
• Scroll type rough pumping; cryogenic high vacuum pumping.
• Standard configurations compatible with up to 8" x 8" (200mm x 200mm) square substrates, up to 350°C heating, glove box, up to five mask storage shelves with motorized transfer, and wedge tool options.
• Recipe driven computer system control with data logging option available.
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Thin Film Deposition Cluster Tools Overview

Cluster tools offer the most deposition capability of all the KJLC^® system platforms, allowing users to incorporate up to 8 deposition modules positioned around a central wafer transfer hub. Nearly every deposition, process, or analysis technique is available as a bolt-on or multi-technique module, including but not limited to, thermal evaporation, organic evaporation, magnetron sputtering, electron beam evaporation, atomic layer deposition, and surface analysis equipment.

The Kurt J. Lesker Company manufactures two standard cluster tool system platforms: LUMINOS^® and OCTOS^®.

Each of the cluster tool systems that we manufacture has a variety of features and options suitable to tailor a platform for your particular process needs. These options are based on, but not limited to, modules based on our stand-alone system platforms. Below is an overview of each platform's basic usage and characteristics.

For more information about the capabilities and features of our cluster tool platforms please see below.

LUMINOS^®

LUMINOS™ – Manual Thin Film Deposition Cluster Tool Incorporating Up to 8 Process Modules

• KJLC's manual cluster tool system platform, designed specifically with the mid to high-level user in mind.
• Typically used in the university and government lab R&D environment.
• Incorporates a central Radial Distribution Center enabling connection of up to 8 process modules.
• Multi-chamber capability for device fabrication and thin film deposition and analysis.
• Magnetron sputtering, thermal evaporation, electron beam evaporation, organic materials evaporation, and atomic layer deposition techniques available.
• Standard configurations compatible with up to 6" x 6" (150mm x 150mm) square substrates, sample heating, cooling, bias, and cleaning options available.
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OCTOS^®

OCTOS^® – Automated Thin Film Deposition Cluster Tool Incorporating Up to 8 Process Modules

• KJLC's automated cluster tool system platform, designed specifically with the high-level researcher in mind.
• Incorporates a central robotic sample transfer system enabling connection of up to 8 process modules.
• Multi-chamber capability for device fabrication, thin film deposition and analysis, GMR magnetic films R&D/production, and organic displays, lighting or electronics.
• Magnetron sputtering, thermal evaporation, electron beam evaporation, organic materials evaporation, and atomic layer deposition techniques available.
• Standard configurations compatible with up to 8" x 8" (200mm x 200mm) square substrates; sample heating, cooling, bias, and cleaning options available.
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Custom Thin-Film Deposition Systems & Capabilities Overview

We manufactured our first thin film vacuum deposition system over 20 years ago at our U.S. headquarters in Pittsburgh, PA. Hundreds of systems later, our proven Process Equipment Division, with engineering, manufacturing, and clean-room assembly areas in the U.S. and U.K., are positioned to offer custom vacuum systems designed and manufactured to exacting specifications for your specific process application.

We can develop simple single chamber bell jar systems for smaller R&D applications to complex multi-chamber computer-controlled cluster tool systems for OLED/PLED production, and everything in-between. Our systems can include a variety of deposition techniques, including magnetron sputtering (RF, DC, and Pulsed DC) sources in both linear and circular configurations, ion sources for substrate cleaning and assisted deposition, electron beam evaporation, and thermal evaporation for metals and organics.

Whether your process requires HV or UHV vacuum levels, our Process Equipment Division delivers–from GMR and OLED/PLED R&D and device fabrication systems through industrial box coaters and space simulation systems.

For more information about the capabilities and features of our custom system platforms please see the link below:

• Custom Thin-Film Deposition Systems & Capabilities

Custom Thin-Film Deposition Systems & Capabilities